PolyMide™ CoPA

Technical

PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.

PolyMide™ CoPA

PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.

Basic Materials Data

Nozzle Temperature:
250˚C – 270˚C

Printing Speed:
30mm/s – 60mm/s

Bed Temperature:
25˚C – 50˚C

Bed Surface:
almost any surface with a thin coat of Nano Adhesive

Cooling Fan:
OFF

Printing Setting

Young’s Modulus:
2223 ± 199 Mpa

Tensile Strength:
66.2 ± 0.9 Mpa

Bending Strength:
97.0 ± 1.1 Mpa

Charpy Impact Strength:
9.6 ± 1.4 kJ/m2

Mechanic Properties

Glass Transition Temperature:
67˚C

Vicat Softening Temperature:
180˚C

Melting Temperature:
190˚C

Thermal Properties

Available in