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3DXTECH™ 3DXSTAT™ ESD ABS

About The Materials 

3DXSTAT™ ESD ABS is an advanced ESD-Safe compound designed for use in critical applications which require electrostatic discharge (ESD) protection and a high level of cleanliness. Manufactured with consistency in mind, 3DXTECH starts with premium ABS and then compounds it according to a proprietary formulation of multi-wall carbon nanotubes – giving you a filament with excellent printing characteristics and consistent ESD properties.

Materials Documentations

Benefits of ABS Include:

  • Durable and sturdy parts off practically every machine on the market

  • Easier to print than most industrial-grade materials

  • Higher melting point and thermal properties than PLA or PETG

  • Ideal for prototyping or end-use parts among both industry engineers and hobbyists alike


Benefits of 3DXSTAT™ Include:

  • Consistent surface resistivity

  • Improved retention of impact & elongation

  • Low particulate contamination

  • Minimal contribution to outgassing and ionic contamination


Target Conductivity for 3DXSTAT ESD ABS:

  • 10^7 to 10^9 ohm surface resistivity on 3DP sample using concentric ring test method.

  • Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry. Therefore, expect some trial time to understand how ESD ABS filament works in your specific printer / application.


Surface Conductivity as a Function of Extruder Temperature:

The surface resistance of the printed ESD-safe part will vary depending on the printer’s extruder temperature. For example, if your testing indicates the part is too insulative, then increasing the extruder temperature will result in improved conductivity. Therefore, the surface resistance can be ‘dialed-in’ by adjusting the extruder temperature up or down depending on the reading you receive on your ESD ABS part.


3DXSTAT ESD PC - Surface Conductivity as a Function of Extruder Temperature:
3DXSTAT ESD ABS - Surface Conductivity as a Function of Extruder Temperature

应用

Semi-con: HDD Components, Wafer Handling, Jigs, Casings, & Connectors
Industrial: Conveying, Metering, and Sensing Applications

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